High Quality Wave Soldering Equipment I.C.T-W3

Enhancing Connectivity with State-of-the-Art Wave Soldering Equipment

The core principle of wave soldering involves the utilization of a molten solder wave to establish robust electrical and mechanical connections between through-hole components and a printed circuit board (PCB). This advanced process unfolds in several meticulously orchestrated steps:

1. Flux Application: Initiated by our cutting-edge wave soldering equipment, the PCB undergoes a meticulous flux application. This chemical substance impeccably cleans the surfaces earmarked for soldering, simultaneously preventing oxidation during the soldering process.
2. Preheating Precision: Our wave soldering equipment ensures precise preheating of the PCB to an optimal temperature. This step activates the flux, priming the surfaces for seamless soldering.
3. Wave Soldering Brilliance: The crowning glory of our wave soldering equipment is witnessed during the wave soldering stage. As the PCB gracefully traverses over the molten solder wave—composed typically of a tin and lead amalgamation—our innovative pump technology propels the solder over a weir and through a series of nozzles. This ensures a flawless flow of solder through the holes in the board, forging steadfast connections between components and the PCB.
4. Cooling Mastery: Post the wave soldering spectacle, our equipment orchestrates a meticulous cooling process. This step solidifies the solder, completing the soldering sequence with finesse.

While the wave soldering process predominantly caters to through-hole components, where leads seamlessly insert into PCB holes, our equipment stands as a beacon of technological prowess. For surface-mount components, seamlessly attached to the board’s surface, we recommend exploring our alternative solution—reflow soldering. Elevate your soldering experience with our unparalleled wave solder equipment, where precision meets performance for seamless electronic connectivity.

Specification of Wave Soldering Equipment

• PCB width: 60 – 350 mm
  PCB clap finger: Double hook claw (standard)

• Solder pot temperature: 300°C
• Solder pot capacity: 300 kg
• Solder pot warm-up time*: approx. 120 min (setting: 250°C)
  * The W2 wave solder has a timer function that can be set to preheat the solder pot in advance before productio

• Preheating zones: 3
• Preheating length: 1400 mm

• Machine size: 3.600 x 1.250 x 1.500 mm
• Machine weight: Approx. 1.000 kg

Please Contact Us directly for more specifications of the I.C.T W3 Wave Soldering Equipment