Ultra Compact Wave SolderIi I.C.T-W4

1. Closed-Loop Speed Control: Elevate your soldering precision with the W4’s closed-loop speed control systems, ensuring stable wave solder transportation. Benefit from exceptional control accuracy with a variance of ± 2 mm/min.
2. Temperature Control Mastery: The W4 is equipped with an independent PLC + PID temperature control system, guaranteeing precise temperature regulation during the soldering process. Additionally, real-time monitoring of preheat temperatures enhances operational control.

Choose the W4 System for a cutting-edge solution that redefines precision and reliability in the world of wave soldering. Elevate your THT soldering processes with ICT’s flagship W Series model.

Enhancing Connectivity with State-of-the-Art w4

The core principle of wave soldering involves the utilization of a molten solder wave to establish robust electrical and mechanical connections between through-hole components and a printed circuit board (PCB). This advanced process unfolds in several meticulously orchestrated steps:

1. Flux Application: Initiated by our cutting-edge W4, the PCB undergoes a meticulous flux application. This chemical substance impeccably cleans the surfaces earmarked for soldering, simultaneously preventing oxidation during the soldering process.
2. Preheating Precision: Our wave soldering equipment ensures precise preheating of the PCB to an optimal temperature. This step activates the flux, priming the surfaces for seamless soldering.
3. Wave Soldering Brilliance: The crowning glory of our W4 is witnessed during the wave soldering stage. As the PCB gracefully traverses over the molten solder wave—composed typically of a tin and lead amalgamation—our innovative pump technology propels the solder over a weir and through a series of nozzles. This ensures a flawless flow of solder through the holes in the board, forging steadfast connections between components and the PCB.
4. Cooling Mastery: Post the wave soldering spectacle, our equipment orchestrates a meticulous cooling process. This step solidifies the solder, completing the soldering sequence with finesse.

While the wave soldering process predominantly caters to through-hole components, where leads seamlessly insert into PCB holes, our equipment stands as a beacon of technological prowess. For surface-mount components, seamlessly attached to the board’s surface, we recommend exploring our alternative solution—reflow soldering. Elevate your soldering experience with our unparalleled wave solder equipment, where precision meets performance for seamless electronic connectivity.

Specification of w4

• PCB width: 60 – 350 mm
  PCB clap finger: Double hook claw (standard)

• Solder pot temperature: 300°C
• Solder pot capacity: 350 kg
• Solder pot warm-up time*: approx. 120 min (setting: 250°C)
  * The W4 wave solder has a timer function that can be set to preheat the solder pot in advance before productio

• Preheating zones: 4
• Preheating length: 1800 mm

• Machine size: 4.200 x 1.250 x 1.500 mm
• Machine weight: Approx. 1.500 kg

Please Contact Us directly for more specifications of the I.C.T W4