I.C.T SS430 Selective Soldering Equipment for THT Assembly
Explore the I.C.T-SS430 selective soldering wave machine PCB for efficient and precise soldering. Ideal for high-quality PCB production with advanced features. Choose based on your specific requirements or Contact Us directly!
Offline model: I.C.T SS430
Online model:
Description
I.C.T SS430 Selective Soldering Equipment
The I.C.T SS430 selective soldering equipment is expertly designed to meet the evolving demands of modern electronics manufacturing. This advanced machine is ideal for through-hole components, ensuring precise and consistent soldering for high-end electronic products. Whether you’re working in military electronics, automotive systems, or switching power supplies, the SS430 delivers exceptional reliability and accuracy.
Versatility and High-Performance
The SS430 selective soldering equipment offers superior performance, making it an excellent choice for high-volume production environments. It is engineered to handle frequent product changes with minimal downtime, ensuring that your production flow remains uninterrupted. The machine efficiently manages multiwave soldering, making it versatile enough to meet the needs of various applications.
Efficient Process Control
One of the standout features of the SS430 is its ability to separate the fluxing, preheating, and soldering processes. This separation allows these processes to operate simultaneously, increasing overall efficiency. The machine supports up to two spray heads and includes up to five lower preheating zones. Additionally, the optional upper convection heating system ensures even more precise temperature control, further enhancing soldering quality.
Ideal for Advanced Applications
Designed for high-volume tasks, the SS430 selective soldering equipment is perfect for advanced applications. It integrates seamlessly with assembly stands and peripheral equipment, making it a versatile addition to any production line. The SS430 also connects easily with traceability systems, ensuring comprehensive process control and maintaining the highest standards of soldering quality.
Advantages of Selective Soldering Equipment
Selective Soldering Equipment Parameters
Core Specifications
- PCB Compatibility: Handles a wide range of PCB sizes, from 120x60mm to 500x500mm.
- Flux System: Features a German jet valve for precise flux application and a 1.5L storage tank.
- Preheating: Offers dual-zone preheating for optimal temperature control and consistent results.
- Soldering: Equipped with a stainless steel solder pot and a Swedish electromagnetic pump for reliable wave control.
- Transport: Provides flexible transport height and width adjustments to accommodate various production lines.
- Software: User-friendly interface with both English and Chinese language support, offering versatile programming options.
Detailed Specifications
- Flux Support: Automatic flux alarm for uninterrupted operation.
- Preheating Temperature Range: Adjustable from room temperature to 250°C.
- Solder Pot Capacity: Handles up to 11kg of solder.
- Solder Pot Temperature: Adjustable from room temperature to 300°C.
- Dimensions: Compact footprint of L2560 x W1950 x H1480mm.
- Weight: Approximately 1300kg.
Please Contact Us directly for more specifications of the I.C.T SS430 selective soldering equipment
Enhancing SMT Assembly Efficiency: Essential Equipment and Expert Support
Additional information
Model | SS550 |
---|---|
Flux Storage Tank | 2L |
Flux Support | Flux Alarm, Automatic |
Preheating Mode | Hot air and IR |
Preheating Area | L520mm*W500mm |
Preheating Zone | Top hot air:1,Bottom IR:1 |
Warm-up Time | Approx.15min (setting 150℃) |
Control Mode | PC+PLC |
Nozzle Inner Diameter | Φ 2.5-30mm(Customizable Special dimensions) |
Max PCB Size | 500*500mm |
PCB Thickness | 0.2-5.0mm |
N2 | Purity of N2: 99.998%, 0.3~0.4 MPa,25 L/min,Outer diameter Φ6mm |
Power Supply | 380±10%, 50/60HZ, 35Kw |
Dimension | L2600*W1850*H1650mm |
Weight | Approx:1800kg |