I.C.T-SS430 | DIP Selective Wave Soldering Machine
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Offline model: I.C.T SS430
Online model:
Description
I.C.T-SS430 | DIP Selective Wave Soldering Machine
Enhancing DIP Selective Wave Soldering Machine Introduction
- Unleashing DIP Selective Wave Soldering Machine Versatility
The I.C.T SS430 DIP Selective Wave Soldering Machine compact batch system boasts a minimal space requirement, seamlessly integrating fluxing, preheating, and soldering processes for both batch and in-line production. With the I.C.T SS430 DIP Selective Wave Soldering Machine receive your selective soldering system promptly, minimizing lead time and maximizing productivity.
- Unparalleled Quality, Even at the Entry Level
Ensuring the highest standards in the entry level of DIP Selective Wave Soldering Machine. Elevate your production with a machine that guarantees precision and reliability.
Advantages of DIP Selective Wave Soldering Machine
- Precision in Motion:
- PCB plate fixed, ensuring stability during the soldering process.
- Dynamic spray and soldering platform movement for optimal coverage.
- Elevated Soldering Quality:
- Achieve high soldering quality, significantly improving the overall pass rate.
- Utilize the Selective Soldering Machine for precise and reliable soldering results.
- Modular Design for Flexibility:
- Modular SMEMA online transportation design supports flexible line formation.
- Empower customers with the ability to customize production lines effortlessly.
- Effortless Parameter Control:
- Full PC control for seamless management of all soldering parameters.
- Set and save parameters such as moving path, solder temperature, flux type, solder type, N2 temperature, etc.
- Achieve the best traceability and effortlessly reproduce consistent soldering quality.
- Automated Calibration Functions:
- Auto wave height calibration function ensures stable wave height after each PCB, enhancing overall process stability.
- Upgradeable with Mark positioning function for precise PCB mark point verification.
- Innovative Motion Table Design:
- Self-designed motion table with cast aluminum construction for lighter weight and rapid motion speed.
- Employ Panasonic servo motor and driver for stable, low-noise movement with ballscrew and linear guide rail.
- Enhanced Environmental Protection:
- Dust-proof plate above the motion table prevents flux or solder from damaging the ball screw.
- Select the German-originated jet valve for precise flux application with a solid content below 10%.
- Efficient Flux Management:
- Flux stocked by a pressure tank ensures stable pressure, unaffected by the flux volume.
- Electromagnetic pump coil from a German-imported brand guarantees peak stability and reliability.
- Premium Solder Pot Construction:
- Solder pot made of titanium for leak-proof performance.
- Robust cast iron heater outside the solder pot ensures quick and consistent heat-up.
- Innovative Nitrogen (N2) System:
- N2 online heating system ensures perfect wetting of solder and reduces solder dross.
- Durable Conveyor System:
- Stainless steel roller conveyor for durability, maintaining wear resistance over extended usage periods.
Embrace excellence in DIP Selective Wave Soldering Machine with a machine that embodies precision, flexibility, and reliability. Elevate your production standards with the advanced features of our Selective Soldering Machine.
Specification of DIP Selective Wave Soldering Machine
- Max Fixture Size 500*500mm
- Max PCB Size 500*500mm
- Flux System
Flux Storage Tank: 1L
Spray Nozzle: Germany Jet Valve (Spot and line spraying) 1set
Spray Nozzle Size: 130um (180, 210um Option)
- Preheating System
Preheating Mode: IR Heating
Preheating Area: L500mm*W500mm
Preheating Zone: Bottom: 1
- Soldering System
Solder Pot Quantity 1 set
Solder Capacity: 11Kg
- Software System
Operating System: Windows10
Programming Mode : CCD fast online program. Picture program.
- Option
Spray Nozzle Size: 180, 210um
Spray Nozzle Jam Detection
Auto Feeding Solder Wire
Wave Control-Mechanical pump
Nozzle Type Auto Identify
Soldering Nozzle Jet-flow Status Real
Time Monitoring
Barcode Scanner
- Machine size: L1400*W2580*H1722mm
- Machine weight: Approx. 700 kg
Please Contact Us directly for more specifications of the I.C.T SS430 DIP Selective Wave Soldering Machine
Enhancing SMT Assembly Efficiency: Essential Equipment and Expert Support
Additional information
Model | SS430 |
---|---|
Control system | PC and PLC. |
Drive system | Three axis platform. |
Spray system | Imported fluiding jetting valve. |
Soldering system | 15kg tin pot, impeller, runner, servo system. |
Handling system | Multifunctional fixture device |
Max PCB Size | 400*300mm |
PCB Weight | <5Kg |
PCB Thickness | 0.2-6.0mm |
N2 | Purity of N2: 99.998%, 0.3~0.4 MPa,25 L/min,Outer diameter Φ6mm |
Air Source Flow | 8~12L/min |
Operater Power | 1-3Kw |
Power Supply | 220±10%, 50/60HZ, 5Kw |
Dimension | L1280*W1400*H1650mm |
Weight | Approx:420kg |