I.C.T-Lyra 933D | Reflow Soldering SMT Oven Machine Dual Rail PCB Oven

• Modular design allows for customized heating and cooling zones.

Top Performance

• Ensures optimal heat transfer and exceptional cooling efficiency.
• Cooling zones can be controlled as needed.

Cost-Effective Operation

• Requires minimal maintenance, thanks to powerful residue management.
• Reduced consumption of fluids (gas, water, electricity, exhaust gas) lowers operating costs.

Experience unparalleled flexibility and performance with the I.C.T-Lyra 933D dual rail SMT oven.

Key Features of Reflow Soldering

• Each Lyra reflow solderis made with Nitrogen Standard. Customer can add nitrogen at any time in future
• Special design of guide rail, guide Rail will not deformed.
• The chamber’s hole-free design prevents heat leakage, ensuring accurate temperature control.
• All electrical components and connection points in oven are suspended, ensuring enhanced safety.
• Lyra incorporates a robust motor protection design, preventing motor seizing due to excessive flux.
• Perfect Process control and reliability (Loading effect < 2K)
• Transmission speed 87.5 cm/min and motor frequency 35Hz：
  – Thermal uniformity capacity CI = 2.0 ℃
  – Heat balance capacity Φ = 24.5 ℃ – 27 ℃
  – Air flow is 4.5kl
• Reflow oven flux management system can effectively manage residue and reduce nitrogen consumption.
• Cooling system is more reasonable, water cooling and air cooling can be replaced at any time.

Specification of reflow soldering

• Preheating & peak & Cooling zones: 9 + 3 + 3
• Length of preheating zones: 2575mm
• Length of peak zones: 1155mm
• Length of cooling zones: 1560mm
• Max. temperature: Pre-heating 300 ℃ and peak zones350 ℃

• Mesh Width: Standard 440mm
• Rail Width: Dual Rail: 50 – 290mm*2
• Energy consumptions:
  – standby-mode: 10KW
  – Connected load: 64KW
  – Operating capacity: 12KW

• Dimensions: 6250*1400*1500mm
• Weight: 2800 kg

• Options include e.g.:
  – Water Cooling System
  – Nitrogen System
  – CBS (centre board support) System
  – MES System

Core System & Function of reflow soldering

• Control System
  • Equipped with a PC + Siemens PLC control system for precise and efficient control over the smt oven process.

  Tailored Airflow Management

  • Independent Air Velocity Controlling System ensures optimal thermal performance, uniform heat distribution, and high-quality assembly production in reflow soldering.

  Energy-Efficient Cooling

  • Cooling Configuration Recycles feature reduces thermal loss, enhancing energy efficiency and sustainability of the reflow oven operation.

  Optimized Power Usage

  • Efficient Power Design and Air Management System optimizes power usage and airflow, resulting in improved energy efficiency and reduced operational costs for smt reflwo oven.

  Versatile Industry Standards

  • Each machine in the I.C.T Lyra Series comes with industry-standard features, ensuring access to essential functionalities for diverse reflow soldering applications.

  Nitrogen Ready for Future Adaptability

  • Nitrogen Standard manufacturing allows flexibility for future nitrogen incorporation, ensuring the reflow soldering oven meets evolving production requirements and industry standards.