I.C.T-LV733 | LV Series Vacuum Reflow Oven
I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various
I.C.T-LV733/733N Seven Zone
LV Series Vacuum Reflow Oven
I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various soldering processes, LV Series Vacuum Reflow Oven is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness. Its new design concept fully meets the needs of increasingly diverse processes. And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products .
- PC + PLC control system
- Vacuum system: reduce the void rate to less than 2%
- First-class heating module hot air system
- Using third-party over-temperature protection
- Heating module transverse reflow design
- Hot air motor with independently inverter controlled
Tips: What is the purpose of a reflow oven?
The purpose of a reflow oven is to solder electronic components to a printed circuit board (PCB) using a process called reflow soldering. Reflow soldering is a technique that involves heating the PCB to a specific temperature profile that melts the solder paste and creates a strong and reliable mechanical and electrical bond between the electronic components and the PCB.
The reflow oven provides precise temperature control and heating profiles to ensure that the solder melts and solidifies in a controlled manner, resulting in a consistent and reliable solder joint. This is essential for high-quality electronics manufacturing, where the reliability and longevity of the final product are critical.
|Max. soldering temperature||
pre-heating zones 300 ℃ and peak zones350 ℃
|Warm up Time||
ca. 20 min
3(top 3/bottom 3)
L500 – W400mm