I.C.T-LV733 | LV Series Vacuum Reflow Oven

• • PC + PLC control system
  • Vacuum system: reduce the void rate to less than 2%
  • First-class heating module hot air system
  • Using third-party over-temperature protection
  • Heating module transverse reflow design
  • Hot air motor with independently inverter controlled

Tips: What is the purpose of a reflow oven?

The purpose of a reflow oven is to solder electronic components to a printed circuit board (PCB) using a process called reflow soldering. Reflow soldering is a technique that involves heating the PCB to a specific temperature profile that melts the solder paste and creates a strong and reliable mechanical and electrical bond between the electronic components and the PCB.

The reflow oven provides precise temperature control and heating profiles to ensure that the solder melts and solidifies in a controlled manner, resulting in a consistent and reliable solder joint. This is essential for high-quality electronics manufacturing, where the reliability and longevity of the final product are critical.

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