I.C.T-L10 | Lead Free Reflow Oven Price Nitrogen Reflow Soldering Machine
Description
I.C.T-L10 | Lead Free Reflow Oven Price
- Simple: Intuitive, easy to learn, maintain.
- Expertise: Advanced design, top brand components.
- Hedging: Imported hardware, low failure rate.
- Safety: Meets international safety standards, high security.
- Stable: Mature software, robust hardware, consistency.
Key Features of Lead Free Reflow Oven
- Segmented design for enhanced efficiency and cost-effectiveness
- Durable guide rails for long-lasting performance
- Hole-free chamber design for accurate temperature control
- Suspended electrical components for improved safety
- Robust motor protection design to prevent motor seizing
- Precise temperature control within ±1℃
- Uniform heating across the reflow chamber
Specification of
Lead Free Reflow Oven Price
- Number of Heating Zones: Up10/Bottom10
- Length of Heating Zones: 3121mm
- Length of Cooling Zones: 600mm
- Temperature Control Method: PID+SSR
- Max. temperature: Pre-heating 300 ℃ and peak zones350 ℃
- Mesh Width: Standard 450mm
- Rail Width: Single Rail: 50 – 400mm
- Energy consumptions:
– standby-mode: 8KW
– Connected load: 55KW
– Operating capacity: 12KW
- Dimensions: 5000*1250*1460mm
- Weight: 1600kg
- Options include e.g.:
– CBS (centre board support) System
– Custom Split Unit
– Custom 24 temperature zone
– MES System
Core System & Function of Lead Free Reflow Oven
- PC + Siemens PLC Control System: I.C.T L series PCB reflow soldering machine quipment offers precise temperature control for enhanced stability, guaranteeing a temperature stability rate exceeding 99.99%.
- Efficient Hot Air System: Equipped with a first-class heating module and an optimal temperature zone interval design, our system ensures uniform and repeatable temperature. Achieving temperature stabilization within less than 20 minutes, it maintains control accuracy of ±1℃, adapting to varying ambient temperatures.
- Intuitive Monitoring Software: It facilitates easy operation, offering functions such as operation record-keeping, temperature curve measurement and analysis, virtual simulation, fault self-diagnosis, real-time process monitoring, and automatic generation and storage of process control documents. Additionally, it provides a dynamic display of substrate transport.
- Adaptable Cooling System: I.C.T PCB reflow soldering machine includes a new cooling zone with quick and easy adjustment capabilities, effectively meeting cooling requirements for different slopes.
- Temperature Protection: Employing third-party over-temperature protection for the In-Circuit Test (I.C.T.), our system ensures a multi-layered approach to safeguard operations and maintain a secure working environment.
- Versatile Design: Featuring central support, dual transmission capabilities, and an optional external water cooling system, our equipment offers adaptability and customization to meet diverse operational needs.
Enhancing SMT Assembly Efficiency: Essential Equipment and Expert Support
Additional information
Model | I.C.T-L10 |
---|---|
Dimensions | 5800x1250x1490mm |
Heating Zones | Up10/Bottom10 |
Control System | PLC+Computer |
Temperature Control Method | PID + SSR |
Transmission Agent | Chain + Mesh |
Electric Supply Required | 3phase,380V 50/60Hz |
Warming Time | Approx.25 minute |
Max. Width Of PCB | 400mm |
Weight | Approx1600KG |