I.C.T-L10 | Lead Free PCB Reflow Soldering Machine

• Simple: Intuitive, easy to learn, maintain.
• Expertise: Advanced design, top brand components.
• Hedging: Imported hardware, low failure rate.
• Safety: Meets international safety standards, high security.
• Stable: Mature software, robust hardware, consistency.

Key Features of PCB Reflow Soldering Machine

• Special design of guide rail, guide Rail will not deformed.
• The chamber’s hole-free design prevents heat leakage, ensuring accurate temperature control.
• All electrical components and connection points in PCB reflow soldering machine are suspended, ensuring enhanced safety.
• L series incorporates a robust motor protection design, preventing motor seizing due to excessive flux.
• Perfect Process control and reliability (Loading effect < 2K)
• Transmission speed 87.5 cm/min and motor frequency 35Hz：
  – Thermal uniformity capacity CI = 2.0 ℃
  – Heat balance capacity Φ = 24.5 ℃ – 27 ℃
  – Air flow is 4.5kl

Specification of PCB reflow soldering machine:

• Number of Heating Zones: Up8/Bottom8
• Length of Heating Zones: 3121mm
• Length of Cooling Zones: 600mm
• Temperature Control Method: PID+SSR
• Max. temperature: Pre-heating 300 ℃ and peak zones350 ℃

• Mesh Width: Standard 450mm
• Rail Width: Single Rail: 50 – 400mm
• Energy consumptions:
  – standby-mode: 8KW
  – Connected load: 55KW
  – Operating capacity: 12KW

• Dimensions: 5000*1250*1460mm
• Weight: 1600kg

• Options include e.g.:
  – CBS (centre board support) System
  – Custom Split Unit
  – Custom 24 temperature zone
  – MES System

Core System & Function of PCB reflow soldering machine:

• PC + Siemens PLC Control System: I.C.T L series PCB reflow soldering machine quipment offers precise temperature control for enhanced stability, guaranteeing a temperature stability rate exceeding 99.99%.
• Efficient Hot Air System: Equipped with a first-class heating module and an optimal temperature zone interval design, our system ensures uniform and repeatable temperature. Achieving temperature stabilization within less than 20 minutes, it maintains control accuracy of ±1℃, adapting to varying ambient temperatures.
• Intuitive Monitoring Software: It facilitates easy operation, offering functions such as operation record-keeping, temperature curve measurement and analysis, virtual simulation, fault self-diagnosis, real-time process monitoring, and automatic generation and storage of process control documents. Additionally, it provides a dynamic display of substrate transport.
• Adaptable Cooling System: I.C.T PCB reflow soldering machine includes a new cooling zone with quick and easy adjustment capabilities, effectively meeting cooling requirements for different slopes.
• Temperature Protection: Employing third-party over-temperature protection for the In-Circuit Test (I.C.T.), our system ensures a multi-layered approach to safeguard operations and maintain a secure working environment.
• Versatile Design: Featuring central support, dual transmission capabilities, and an optional external water cooling system, our equipment offers adaptability and customization to meet diverse operational needs.