JUKI Chip Mounter Machine High Speed JUKI FX-3RA

Placement Speed: 80,000 CPH (Optimum); 65,000 CPH (IPC9850).
PCB Size: 50x50mm to 510x360mm.
Component Range: 0402 to 33.5mm square (or diagonal up to 47mm).
Placement Accuracy: ±0.05mm (Cpk ≥1).
Feeder Capacity: Up to 120 (8mm tape feeders).
Special Features: Multi-head configuration, laser centering, touch panel interface.
Component Height: Up to 33.5mm.

Description

1-4 Bowl Feeder for JUKI Instertion Machine

Chip Mounter Machine

The chip mounter machine delivers fast, precise placement for electronics assembly. Ideal for high-volume production, it handles a wide range of components with accuracy. Its modular design ensures flexibility, adapting to various PCB needs. I.C.T provides expert setup and training, ensuring seamless integration into your SMT line. This chip mounter machine offers reliable performance, making it a top choice for efficient, high-quality PCB manufacturing.

High Precision SMT Pick and Place Machine Features

Rapid Component Placement

The chip mounter machine achieves up to 80,000 components per hour, using a multi-head system to optimize speed. This feature supports high-volume SMT production, ensuring precision across PCB sizes. It’s ideal for manufacturers needing fast, reliable assembly, reducing cycle time while maintaining consistent quality for electronics production.

Modular Production Flexibility

The chip mounter machine’s modular design allows easy configuration for different production needs. Independent beams enable simultaneous pick-and-place, enhancing throughput. This flexibility supports varied PCB types, making it perfect for manufacturers handling diverse, high-speed assembly tasks without compromising efficiency.

Precision Laser Centering

Equipped with advanced laser technology, the chip mounter machine ensures accurate component placement. It handles parts from 0402 to 33.5mm with high resolution, reducing defects. This feature supports high-density PCB assembly, delivering consistent quality for complex electronics manufacturing requirements.

Specifications of High Speed PCB Pick and Place Machine

High Speed Chip Mounter Machine

Mounting Speed:
– 90,000CPH (0.040Sec. / chip / Optimum）
– 66,000CPH (IPC9850)

PCB Size
– L size(410x360mm)
– L-Wide size(510x360mm)
– Applicability to long PWB 800 x 360mm

Placement accuracy ±0.05mm (±3o)

Feeder Count
– Max. 240 in case of 8mm tape (on a Electric double tape feeder)

Component height: 6mm

Component size
– 0402(01005)～□33.5mm

Machine Size
– L size 2,650 x 1,650 x 1,530mm
– L-Wide size 2,880 x 1,650 x 1,530mm
– XL size 2,880 x 1,850 x 1,530mm

Machine Weight :
– L, L-Wide size 3,500kg
– XL size 3,750kg

LED Pick & Place Machine: Video Showcase

Watch our video, Computer Power Manufacturer Showcases I.C.T SMT & DIP Line. It highlights a complete SMT line with loader, cleaner, printer, chip mounter machine, reflow oven, and AOI. The DIP line includes wave soldering and ICT testing. I.C.T engineers provide expert setup and training for seamless operation.

More SMT Line Machines

Equipment	Description
Loader	Loads PCB into the production line automatically.
Auto Printer	Applies solder paste with high precision.
Conveyor	Moves PCB smoothly between machines.
Pick and Place Machine	Places components accurately on PCB.
Reflow Oven	Melts solder to bond components securely.
AOI Machine	Inspects PCB for defects automatically.
Unloader	Removes finished PCB from the line.

PCB Loader

Solder Paste Printer

SMD Pick and Place Machine

Reflow Oven

AOI Inspection

X-ray Inspect

I.C.T Installation and Training Success

I.C.T engineers ensure smooth setup and training for the chip mounter machine at customer sites. Our team provides hands-on guidance, ensuring efficient operation. A group photo with satisfied clients after training reflects their trust in I.C.T’s reliable service and high-quality equipment, ensuring successful production outcomes.

Customer Factory and Trusted Partnership 05 Product Factory Details

SMT Chip Mounter: Customer Feedback

Customers praise the chip mounter machine for its speed and precision. They value I.C.T’s quick pre-sale responses and fast after-sale support. Many highlight its reliable performance in SMT assembly, making it a preferred choice. I.C.T’s commitment to quality service earns consistent positive reviews from global manufacturers.

Good Feedback 03 Product Factory Details

Certified Quality Standards

The chip mounter machine holds CE and ISO9001 certifications, ensuring safety and quality. It also includes multiple patent certificates, reflecting innovative design. These credentials highlight I.C.T’s dedication to delivering advanced, reliable solutions for electronics manufacturing, meeting global standards.

I.C.T SMT Machine Certificate 01 Product Factory Details

About I.C.T Company

I.C.T is a leading provider of SMT and DIP assembly solutions, specializing in equipment like the chip mounter machine. With extensive expertise, we offer complete support, from installation to training. Based in China, I.C.T delivers European-quality standards, ensuring efficient, dependable production lines for electronics manufacturers worldwide.

I.C.T Factory and Team Product Factory Details

Frequently Asked Questions

What components can the Advanced Flexible Mounter handle?

An Advanced Flexible Mounter can process a wide range of electronic components, from small 0402 chips to devices measuring up to 33.5 mm square. This makes the SMT pick and place machine suitable for assembling resistors, capacitors, ICs, connectors, LEDs, and many specialty components used in modern electronics. The machine is designed for both high-volume and high-mix production environments. To achieve the best placement quality, operators should use the correct nozzle type and feeder configuration for each component category and production requirement.
How fast is the Smart Pick n Place Machine?

A Smart Pick n Place Machine can achieve placement speeds of up to 80,000 components per hour (CPH), making it suitable for demanding SMT production lines. High placement speed helps manufacturers increase throughput while maintaining consistent quality. Actual performance depends on factors such as component variety, PCB complexity, feeder arrangement, and programming strategy. To maximize production efficiency, manufacturers should optimize feeder layouts, reduce changeover times, and perform regular preventive maintenance. These practices help maintain stable output and reduce unnecessary downtime.
Can it handle large PCBs?

Yes, the Advanced Flexible Mounter can handle PCBs up to 510 × 360 mm, making it suitable for many consumer electronics, industrial control systems, communication products, and LED assemblies. Supporting larger boards allows manufacturers to place more components on a single PCB and improve production flexibility. For optimal results, operators should verify board thickness, flatness, and support requirements before production. Proper conveyor settings and board support mechanisms help maintain placement accuracy and reduce the risk of misalignment during high-speed assembly operations.
Does it support large PCBs?

Yes, certain configurations of the Advanced Flexible Mounter can support PCB sizes up to 810 × 400 mm while maintaining high placement precision. This capability is valuable for large-format LED lighting products, display boards, power electronics, and industrial equipment. Processing larger PCBs requires stable board transport and accurate positioning throughout the SMT assembly process. Manufacturers should evaluate board dimensions, weight, and production volume before selecting machine configurations. Proper setup helps ensure consistent placement quality and reliable production performance on oversized boards.
How does laser alignment enhance SMT placement?

Laser alignment enhances SMT placement by measuring component position and orientation before placement occurs. This allows the SMT placement machine to make automatic corrections in real time and improve positioning accuracy. The technology is especially useful for fine-pitch ICs, small chip components, and mixed-component production. By reducing placement deviations, laser alignment helps minimize defects such as skewed parts, poor solder joints, and component misalignment. Regular calibration and vision system verification can further improve placement performance and production quality.

Additional information

Model	JUKI FX-3RA
Board Size	– L size(410x360mm) – L-Wide size(510x360mm) – Applicability to long PWB 800 x 360mm
Component height	25 mm
Component size	0201*1 ～□74 ㎜ /150×50 ㎜
Placement speed	– 90,000CPH (0.040Sec. / chip / Optimum） – 66,000CPH (IPC9850)
Placement accuracy	±35μｍ（Cpk≧1）
Feeder Input	– Max. 240 in case of 8mm tape (on a Electric double tape feeder)