I.C.T ETA SS330 Selective Soldering | Modular Design for Flexibility
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Offline model: I.C.T SS430
Online model:
Description
I.C.T ETA sS330 selective soldering
Enhancing ICT ETA sS330 selective soldering Introduction
The ETA ss330 selective soldering is designed to elevate your soldering process with precision and efficiency. Its modular design features a 1 Spray + 1 Preheating + 3 Soldering configuration, enabling simultaneous fluxing, preheating, and soldering. This advanced ICT selective solder machine supports up to two spray heads and five lower preheating elements, with additional upper convection heating for optimal temperature control. It integrates seamlessly with other assembly equipment, offering full connectivity to traceability systems for precise production line control.
Ideal for High-Precision Electronics
Perfect for industries requiring meticulous soldering, the ETA ss330 selective soldering is built for high-reliability applications. It’s ideal for military electronics, automotive systems, and power supply manufacturing, where consistent and top-tier soldering performance is crucial. This machine ensures the quality and reliability needed for complex electronic assemblies, making it an essential tool for advanced production environments.
Improved Product Features for ETA sS330 selective soldering
Precision and Flexibility
- Dynamic Soldering: The fixed PCB plate and dynamic spray/soldering platform ensure precise soldering.
- Modular Design: SMEMA-compliant design allows for flexible line configurations.
- PC Control: Comprehensive PC control for parameter settings and traceability.
Quality and Efficiency
- Superior Soldering: Achieve higher pass rates with advanced soldering technology.
- Auto Calibration: Automatic wave height calibration for consistent soldering.
- Mark Positioning: Optional feature for accurate PCB mark verification.
- Efficient Motion: Lightweight cast aluminum motion table for quick and stable movement.
- High-Quality Components: Panasonic servo motors and drivers, ball screws, and linear guide rails for reliable performance.
Durability and Maintenance
- Dust Protection: Prevents damage to the ball screw with a dust-proof plate.
- Precise Flux Application: German-origin jet valve for accurate flux placement.
- Stable Flux Storage: Pressure tank ensures consistent flux delivery.
- Reliable Solder Pot: Titanium construction and cast iron heater for durability.
- N2 Online Heating: Optimizes soldering and reduces dross.
- Durable Conveyor: Stainless steel rollers for long-lasting performance.
ETA ss330 selective soldering Specifications
- PCB Size (with Fixture): 120x60mm to 500x500mm
- Flux System:
- Flux Storage Tank: 1.5 liters
- Flux Support: Includes flux alarm and automatic features
- Spray Nozzle: Germany Jet Valve (for spot and line spraying)
- Spray Nozzle Size: 130um (options: 180, 210um)
- Preheating System:
- Preheating Mode: Hot air and infrared (IR)
- Preheating Area: 500mm x 500mm
- Preheating Zones: 2 top hot air, 1 bottom IR
- Preheating Temperature: Room temperature to 250°C
- Control Mode: PC + PLC
- Soldering System:
- Double Pot: Available as an option
- Solder Pot: Made from stainless steel with Japan SURF high-temperature and corrosion-resistant treatment
- Wave Control: Electromagnetic pump (Sweden)
- Solder Pot Quantity: 1 set
- Solder Capacity: 11 kg
- Solder Pot Temperature: Room temperature to 300°C
- Transport System:
- Transport Height: 900 ± 20mm
- Transport Width: 60 to 500mm
- Width Adjustment: Automatic
- Software System:
- Operating System: Windows 10
- Language: English and Chinese (switchable)
- Programming Modes: CCD fast online programming, offline programming, picture programming
- Machine Dimensions:
- Size: 2560mm (L) x 1950mm (W) x 1480mm (H)
- Weight: Approximately 1300 kg
Please Contact Us directly for more specifications of the ETA ss330 selective soldering.
Enhancing SMT Assembly Efficiency: Essential Equipment and Expert Support
Additional information
Model | SS550 |
---|---|
Flux Storage Tank | 2L |
Flux Support | Flux Alarm, Automatic |
Preheating Mode | Hot air and IR |
Preheating Area | L520mm*W500mm |
Preheating Zone | Top hot air:1,Bottom IR:1 |
Warm-up Time | Approx.15min (setting 150℃) |
Control Mode | PC+PLC |
Nozzle Inner Diameter | Φ 2.5-30mm(Customizable Special dimensions) |
Max PCB Size | 500*500mm |
PCB Thickness | 0.2-5.0mm |
N2 | Purity of N2: 99.998%, 0.3~0.4 MPa,25 L/min,Outer diameter Φ6mm |
Power Supply | 380±10%, 50/60HZ, 35Kw |
Dimension | L2600*W1850*H1650mm |
Weight | Approx:1800kg |