Shenzhen SMT Soldering Machine I.C.T Lyra 622

• Highest flexibility
  – Modular machine concept
  – Individual configuration of heating and cooling zones
• Best of Class Performance
  – Optimal heat transfer
  – Excellent cooling performance
  – Controllable cooling zones
• Low Operating Costs
  – Minimal maintenance efforts thanks powerful Residue
  – Management System
  – Reduced consumption of fluids (gas, water, current, exhausted gas)

Key Features of Shenzhen SMT Soldering Machine

• Each Lyra PCB Nitrogen Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future
• Special design of guide rail, guide Rail will not deformed.
• The chamber’s hole-free design prevents heat leakage, ensuring accurate temperature control.
• All electrical components and connection points in oven are suspended, ensuring enhanced safety.
• Lyra incorporates a robust motor protection design, preventing motor seizing due to excessive flux.
• Perfect Process control and reliability (Loading effect < 2K)
• Transmission speed 87.5 cm/min and motor frequency 35Hz：
  – Thermal uniformity capacity CI = 2.0 ℃
  – Heat balance capacity Φ = 24.5 ℃ – 27 ℃
  – Air flow is 4.5kl
• Lyra flux management system can effectively manage residue and reduce nitrogen consumption.
• Cooling system is more reasonable, water cooling and air cooling can be replaced at any time.

Specification of PCB Reflow Oven:

• Preheating & peak & Cooling zones: 6 + 2 + 2
• Length of preheating zones: 2260mm
• Length of peak zones: 770mm
• Length of cooling zones: 1160mm
• Max. temperature: Pre-heating 300 ℃ and peak zones350 ℃

• Mesh Width: Standard 440mm
• Rail Width: Single Rail: 50 – 460mm
• Energy consumptions:
  – standby-mode: 8KW
  – Connected load: 45KW
  – Operating capacity: 10KW

• Dimensions: 5150*1400*1500mm
• Weight: 2400 kg

• Options include e.g.:
  – Water Cooling System
  – Nitrogen System
  – CBS (centre board support) System
  – MES System

Core System & Function of Reflow Oven:

• PC + Siemens PLC Control System: The I.C.T Lyra Series Shenzhen SMT Soldering Machine is equipped with a cutting-edge control system, integrating a PC and Siemens PLC. This sophisticated combination ensures precise and efficient control over the entire reflow process, enhancing the overall performance and reliability of the machine.
• Independent Air Velocity Controlling System: Our PCB Reflow Oven features an Independent Air Velocity Controlling System, providing a tailored approach to managing airflows. This innovation allows for optimal thermal performance, ensuring uniform heat distribution throughout the oven, and contributing to the production of high-quality assemblies.
• Cooling Configuration Recycles: The Cooling Configuration Recycles feature is designed to reduce thermal loss during the cooling process. This not only enhances energy efficiency but also contributes to a more sustainable and environmentally friendly operation of the reflow oven.
• Efficient Power Design and Air Management System: The Shenzhen SMT Soldering Machine incorporates an Efficient Power Design and Air Management System, optimizing power usage and airflow within the system. This results in improved energy efficiency, reducing operational costs and making it an environmentally conscious choice for users.
• Industry Standard Features: Each machine in the I.C.T Lyra Series comes equipped with a comprehensive set of industry-standard features. This ensures that users have access to essential functionalities and capabilities required for a wide range of applications, making the reflow oven a versatile solution in the SMT assembly process.
• Nitrogen Standard with Future Flexibility: The I.C.T Lyra Series is manufactured with Nitrogen Standard. Importantly, this design allows customers the flexibility to incorporate nitrogen into the system at any time in the future. This adaptability ensures that the Shenzhen SMT Soldering Machine can meet evolving production requirements and industry standards.