I.C.T Lyra 622 | High Porformance Reflow Soldering Machine with Nitrogen

• Option 1: Emphasizing Key Benefits
  Ultimate Flexibility and Performance
  Modular Design: Customize to your exact needs with individual heating and cooling zone configurations.
  Optimal Heat Transfer: Achieve superior cooling performance and precise temperature control.
  Cost-Effective Operation: Minimize maintenance and reduce fluid consumption with our advanced residue management system.
• Option 2: Focusing on Technical Specifications
  Advanced Features for Optimal Performance
  Modular Design: Flexible configuration with independent heating and cooling zones.
  Superior Thermal Management: Ensures optimal heat transfer and precise temperature control.
  Efficient Operation: Minimizes operational costs through reduced fluid consumption and low maintenance requirements.
• Option 3: Highlighting User Benefits
  Designed for Your Success
  Customizable: Tailor the system to your specific production requirements.
  Reliable: Achieve consistent results with superior thermal performance.
  Cost-Effective: Reduce operating costs and minimize downtime.

Key Features of Lyra Reflow Soldering Machine

• Nitrogen Compatibility: Designed for future nitrogen integration, providing flexibility for enhanced soldering conditions.
• Durable Construction: The guide rail’s special design ensures durability and prevents deformation.
• Precise Temperature Control: The chamber’s hole-free design minimizes heat leakage, maintaining accurate temperature settings.
• Safety Features: Suspended electrical components and connection points enhance safety within the oven.
• Motor Protection: The robust motor protection design prevents motor seizure caused by excessive flux.
• Exceptional Process Control: Delivers precise control with a loading effect of less than 2K.
• Efficient Operation: Features a transmission speed of 87.5 cm/min and a motor frequency of 35Hz, resulting in:
  • Thermal uniformity capacity (CI): 2.0°C
  • Heat balance capacity (Φ): 24.5-27°C
  • Airflow: 4.5kl
• Advanced Flux Management: The Lyra flux management system effectively handles residue and reduces nitrogen consumption.
• Flexible Cooling: The cooling system offers versatility with interchangeable water and air cooling options.

Specification of PCB Reflow Soldering Machine:

Heating and Cooling Zones: 6 preheating, 2 peak, 2 cooling Zone Lengths:

• Preheating: 2260mm
• Peak: 770mm
• Cooling: 1160mm Maximum Temperature:
• Preheating: 300°C
• Peak: 350°C Mesh Width: Standard 440mm Rail Width: Single Rail: 50-460mm Energy Consumption:
• Standby: 8KW
• Connected Load: 45KW
• Operating: 10KW Dimensions: 5150 x 1400 x 1500mm Weight: 2400 kg

Optional Features:

• Water Cooling System
• Nitrogen System
• Center Board Support (CBS) System
• MES System

Core System & Function of PCB Reflow Soldering Machine:

• Advanced Control System: The I.C.T Lyra Series features a powerful PC + Siemens PLC control system for precise and efficient management of the entire reflow process, ensuring optimal performance and reliability.

• Independent Air Velocity Control: Our innovative system provides tailored airflow management for optimal thermal performance, ensuring uniform heat distribution and high-quality assemblies.

• Energy-Efficient Cooling: The Cooling Configuration Recycles feature reduces thermal loss during the cooling process, improving energy efficiency and contributing to a more sustainable operation.

• Optimized Power and Air Management: The efficient power design and air management system minimize energy consumption, reducing operational costs and making it an environmentally friendly choice.

• Industry-Standard Features: Equipped with a comprehensive set of essential features, the I.C.T Lyra Series is a versatile solution for a wide range of SMT assembly applications.

• Nitrogen Compatibility: The standard nitrogen compatibility allows for future integration of nitrogen systems, ensuring the oven can adapt to evolving production needs and industry standards.