I.C.T-S400 | ICT SMT 3D SPI Machine For LED Technology Industry
ICT SPI machine eliminates shadow and random reflection issues in detection, ensuring higher solder paste 3D detection accuracy. With a 5M pixel high-speed camera, it achieves faster detection and delivers detailed, rich images. Ideal for high-speed, high-precision production lines. Explore our variety of models to find the perfect fit for your needs.
Description
I.C.T-S400 SMT 3D SPI Machine
The I.C.T SMT 3D SPI Machine — your ultimate solution for overcoming challenges related to shadows and random reflections during the detection process. Elevate your solder paste 3D detection accuracy to new heights with this advanced system. Boasting a 5M pixel high-speed camera, the I.C.T SMT 3D SPI Machine ensures not only faster detection speeds but also delivers intricate and vivid images. Tailored for high-speed and high-precision production lines, it stands as the ideal choice to enhance your manufacturing efficiency. Embrace innovation with the I.C.T SMT 3D SPI Machine, redefining the standards of accuracy and speed in electronics manufacturing.
Specification of SMT 3D SPI Machine
- Applicable PCB: 55*55 ~460*460mm (standard) / (470*500 as option) / (630*686 as option)
- PCB thickness: 0.5 ~ 7.0mm
- PCB Weight: ≤5.0kg
- Conveyor Height: 900±20mm
- Inspection Head Quantity: 1PCS
- Camera Pixel: 5M, (10M/12M as option)
- Optical Resolution: 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um
- Minimum Chip: 01005 (03015/008004 as option)
- Detection Speed: 0.35 ~ 0.5s/
- Machine Dimension: W1000*D1150*H1530mm
- Weight: 965kg
Feature of SMT 3D SPI Machine
- Multi-frequency PSLM:
Experience cutting-edge detection with our SMT SPI machine, featuring Multi-frequency PSLM technology. By emulating the optical grating cycle through advanced software, we eliminate mechanical drive and transmission parts, significantly boosting accuracy and application scope. Enjoy a detection height up to ±1200um, all while avoiding mechanical wear and reducing maintenance costs. - Phase Modulation Profilermetry (PMP):
Redefining precision, our SMT SPI machine incorporates PMP technology, achieving a remarkable height resolution down to 0.37um. With 4-8 times sampling, we ensure consistently high performance. Elevate your detection capabilities through the phase modulation of the full light spectrum. - High Resolution and High Frame Rate Image Processing Unit:
Unleash the power of our SMT SPI machine’s high-resolution image processing unit. Equipped with a megapixel industrial CCD camera boasting an ultra-high frame rate, it ensures steady and rapid detection of small components and high-density mounting (008004). Choose from a variety of detection accuracy options (5um, 7um, 8um, 10um, 12um, 15um, 18um, 20um) to meet diverse product requirements. - Telecentric Lens for Static Compensation:
Say goodbye to lens distortion issues with our SMT SPI machine’s telecentric lens and specialized software test algorithm. I.C.T resolves ordinary lens problems, squint, and deformation, significantly enhancing inspection accuracy and ability. Achieve industry-leading static compensation for FPC warping. - 2D Lamp Panel:
Enhance accuracy in soldering processes with our SMT SPI machine’s 2D lamp panel. Avoid color distortion effects with RGB tuning, ensuring versatility across different PCB colors. Fulfill various dispensing process tests and significantly improve repeatability accuracy in equipment (height, volume, area). - High Resolution and High Frame Rate Image Processing Unit:
Our SMT SPI machine introduces an Active RGB 2D Light Source with a patented RGB Tune function. This function, along with a unique filter algorithm, solves issues like solder bridge detection false alarms and relative zero surface uncertainty. Experience 2D/3D measurements and precise images of printed solder paste. - High Accurate Hardware Platform:
Built on a high-rigid grade steel frame, our SMT SPI machine ensures high-speed and steady positioning through close loop servo control and high-precision ball screws. Choose optional linear and high-precision linear encode positioning systems for ultra-high resolution and speed, achieving repeatable accuracy down to 1um.
Enhancing SMT Assembly Efficiency: Essential Equipment and Expert Support
Additional information
Model | I.C.T-S400 |
---|---|
PCB Size | 55*55 ~460*460mm |
PCB Tickness | 0.5 ~ 7.0mm |
Conveyor Height | 900±20mm |
Measure Type | Height,Area,Volume,Offset,Bridge,Shape(missing print,insufficient tin, excessive tin, bridging, offset, |
Paste Height | 0 ~ 550um |
Machine Dimension | W1000*D1150*H1530mm |
Weight | 965kg |