I.C.T-SS430 | Off-line Selective Wave Soldering Machine

Selective wave soldering is a special form of wave soldering invented to meet the development requirements of through-hole components soldering. It is mainly suitable for the soldering of through-hole components in high-end electronic products.

Description

I.C.T – SS430

Automatic off-line Selective Wave Soldering Machine for PCB

Advantage:

  • Machine integrated spray, preheating and soldering integrated design.
  • Small floor space and low energy consumption.
  • Maximum PCB passing size: 400 * 300mm.
  • The tin pot is fixed and the PCB board is moved.

Features

  • The piezoelectric ceramic jet valve originated in Germany is selected
  • User-friendly design: reduce equipment failure rates.
  • Core components: using imported components
  • It can control the solder quantity, soldering time and solder quantity of each solder spot.
  • Program creation is simple, using pictures or Gerber data to make production program.
  • Nozzle can be selected according to the size of soldering point
  • PCB pictures can be directly used for path programming. The path starting point, soldering moving speed, empty stroke speed, z-axis height and wave crest height can be set on the computer

Tips: What is selective soldering?

Selective soldering is a type of soldering process used in electronics manufacturing to selectively apply solder to specific areas of a printed circuit board (PCB). It is typically used for components that cannot be soldered using traditional wave soldering or reflow soldering processes.

The selective soldering process involves using a machine that is programmed to apply solder only to specific areas of the PCB. This is accomplished by using a nozzle that dispenses a precise amount of solder onto the target area. The PCB is then moved to another location where the next soldering operation can be performed.

Selective soldering is often used for through-hole components or other components that require a high degree of precision during soldering. It is also used when traditional wave soldering or reflow soldering processes may damage or degrade sensitive components.

Selective soldering offers several advantages over traditional soldering processes, including increased precision, reduced solder waste, and lower overall production costs. However, it also requires specialized equipment and expertise, which can make it more expensive than other soldering methods.

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Additional information

Model

SS430

Control system

PC and PLC.
Real time monitoring camera.
Controller and control card

Drive system

Three axis platform.
XYZ axis:ball screw & linear guide rail.
XYZ axis:servo motor & Driver.

Spray system

Imported fluiding jetting valve.
Flux pressure tank.
Spray gas control.

Soldering system

15kg tin pot, impeller, runner, servo system.
Pot overtemperature and liquid level alarm device.
Pot temperature control system.
N2 independent temperature control system.
Five soldering nozzles (inner diameter 3mm, 4mm,
5mm, 6mm, 8mm)as standard.

Handling system

Multifunctional fixture device

Max PCB Size

400*300mm

PCB Weight

<5Kg

PCB Thickness

0.2-6.0mm

N2

Purity of N2: 99.998%, 0.3~0.4 MPa,25 L/min,Outer diameter Φ6mm

Air Source Flow

8~12L/min

Operater Power

1-3Kw

Power Supply

220±10%, 50/60HZ, 5Kw

Dimension

L1280*W1400*H1650mm

Weight

Approx:420kg