I.C.T-SS330 | Off-line Selective Wave Soldering Machine

Selective wave soldering is a special form of wave soldering invented to meet the development requirements of through-hole components soldering. It is mainly suitable for the soldering of through-hole components in high-end electronic products.


I.C.T – SS330

Automatic off-line Selective Wave Soldering Machine for PCB


  • Machine integrated spray, preheating and soldering integrated design.
  • Small floor space and low energy consumption.
  • Maximum PCB passing size: 400 * 300mm.
  • The tin pot is fixed and the PCB board is moved.


  • The piezoelectric ceramic jet valve originated in Germany is selected
  • User-friendly design: reduce equipment failure rates.
  • Core components: using imported components
  • It can control the solder quantity, soldering time and solder quantity of each solder spot.
  • Program creation is simple, using pictures or Gerber data to make production program.
  • Nozzle can be selected according to the size of soldering point
  • PCB pictures can be directly used for path programming. The path starting point, soldering moving speed, empty stroke speed, z-axis height and wave crest height can be set on the computer

Tips: How do you use a selective soldering machine?

Selective soldering machines are used to solder through-hole components onto printed circuit boards (PCBs) selectively, i.e., soldering only specific areas of the PCB without affecting other areas. Here are the basic steps to use a selective soldering machine:

1. Load the PCB: Load the PCB into the machine’s fixture or holder. Ensure that the PCB is securely held in place to prevent any movement during the soldering process.

2. Program the machine: Input the required soldering parameters such as the solder temperature, preheating temperature, and soldering time into the machine’s software. The machine may also have a vision system that can be programmed to locate the through-hole components on the PCB.

3. Apply flux: Apply flux onto the through-hole component leads using a flux applicator. Flux helps to remove any oxidation from the component leads, ensuring a good solder joint.

4. Preheat the PCB: Preheat the PCB using the machine’s preheating system. The preheating temperature should be set according to the PCB and component specifications.

5. Solder the component: The machine’s soldering nozzle will move to the through-hole component and apply solder onto the component lead. The solder will be melted and then solidified, forming a strong bond between the component and PCB pad.

6. Inspect the solder joint: After soldering, inspect the solder joint using visual inspection or automated inspection systems. Ensure that the solder joint is free of any defects such as insufficient solder or solder bridges.

7. Unload the PCB: Once the inspection is complete, remove the PCB from the machine’s fixture or holder.

Selective soldering machines can have different features and configurations depending on the manufacturer and model. It is essential to follow the manufacturer’s instructions and recommended practices for optimal performance and reliability.

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Additional information



Control system

PLC and touch system.
Off-line programming system.

Drive system

Three axis platform.
XY axis: synchronous belt and guide rail.
Z axis:screw rod and guide rail.
XY axis:stepping motor and drive.
Z axis: servo and drive.

Spray system

Standard atomization valve(optional jetting valve).
Flux pressure tank.
Spray gas control.

Soldering system

15kg tin pot, impeller, runner, servo system.
Pot overtemperature and liquid level alarm device.
Pot temperature control system.
N2 independent temperature control system.
Five soldering nozzles (inner diameter 3mm, 4mm,
5mm, 6mm, 8mm)as standard.

Handling system

Multifunctional fixture device

Max PCB Size


PCB Weight


PCB Thickness



Purity of N2: 99.998%, 0.3~0.4 MPa,25 L/min,Outer diameter Φ6mm

Air Source Flow


Operater Power


Power Supply

220±10%, 50/60HZ, 3Kw