I.C.T-LCO-350 | Automated Depaneling PCBA Online Laser Cutting Machine

Description

I.C.T-LCO-350

PCBA Online Laser Cutting Machine

Features:

• With automatic focusing function to avoid manual focusing positioning deviation;
• The cutting software is easy to learn and comes with graphics editing functions, including inward shrinkage, outward
  expansion, size modification and adjustment, and graphic editing of cutting points;
• With dynamic zoom function: according to the thickness of the customer’s product, the number of times of falling layer by
  layer can be realized when the board is divided, ensuring that the focal length is on the product cutting;
• With CCD automatic positioning, automatic calculation of expansion and contraction compensation function;
• It has three-color light source, which can be adjusted to accurately identify the PCBA optical point and locate the position of
  the sub-board;
• Equipped with a CCD that can read the QR code alone, to achieve MES data upload 1mm*1mm~6mm*6mm, and the code
  reading length is 19 digits;
• The transmission height of the equipment can be adjusted by 900±50mm, and the track length is preferably 1000mm;
• Comes with a laser chiller, equipped with a dust extraction system (automatic vacuum adsorption + laser dust removal);
• Equipment running accuracy ±0.005mm, CPK>1.33, sub-board accuracy ±0.025mm, processing capacity T≤1.6mm;
• In line with the SMT anti-static standard, the product must be made of anti-static material within 30CM;
• The safety door interlocking mechanism is configured, the safety door cannot be opened when the equipment is running, and the equipment cannot be operated after the door is opened. It is equipped with a leakage protector.

Tips: What is PCB laser depaneling?

Laser depaneling is a method of separating individual printed circuit boards (PCBs) from a larger panel or array of multiple PCBs that have been fabricated on a single panel. It is a precise and efficient method of depanelization that uses a laser beam to cut through the substrate material along the scoring lines that were created during the panelization process.

Laser depaneling is commonly used for PCBs with complex geometries or delicate components that require a high level of precision and minimal mechanical stress during separation. The laser beam can be adjusted to cut through the substrate material without damaging the components on the PCB. This method is also ideal for cutting through materials that are difficult to machine, such as ceramics or composite materials.

Laser depaneling can be done with either a CO2 laser or a UV laser, depending on the substrate material and the required precision. CO2 lasers are typically used for cutting through materials such as FR4, while UV lasers are used for cutting through materials such as ceramic or glass.

Some of the benefits of laser depaneling include:

1. High precision: Laser depaneling is a very precise method of separating PCBs, with accuracy down to the micron level.
2. Minimal stress: Laser depaneling does not apply mechanical stress to the PCB, which reduces the risk of damage to components.
3. No tool wear: Laser depaneling does not require any cutting tools, which eliminates the need for tool maintenance or replacement.
4. Flexibility: Laser depaneling can be used for a wide range of PCB geometries and materials, making it a versatile method of depanelization.

Laser depaneling is a critical step in the PCB manufacturing process that requires specialized equipment and expertise. It is important to work with a reputable PCB manufacturer who has experience with laser depaneling to ensure that the process is done correctly and efficiently.

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