I.C.T ETA SS330 Selective Soldering | Modular Design for Flexibility - Image 2

I.C.T ETA SS330 Selective Soldering | Modular Design for Flexibility - Image 3

2-2 Selective wave soldering machine SS430

Selective Wave Soldering Machine Flux system

I.C.T ETA SS330 Selective Soldering | Modular Design for Flexibility

Precise Flux Application: German jet valve delivers 130μm flux dots.
Robust PCB Transport: Side/top clamps secure up to 20kg PCBs.
Smart Control System: PLC with Cat 6 for reliable operation.
Low-Maintenance Design: Tool-free access for quick upkeep.
I.C.T Expert Support: Comprehensive training and after-sales service.

Description
Additional information

Description

I.C.T SS330 Selective Soldering Solution

The I.C.T ETA SS330 selective soldering equipment transforms electronics manufacturing with precision and efficiency. Engineered for through-hole component soldering, it ensures flawless solder joints for industries like automotive, military, and power supplies. Its compact design supports seamless integration into production lines, handling PCBs up to 500x500mm. With a smart PLC control system, the ETA SS330 selective soldering machine offers precise adjustments for consistent results. Features like a German jet valve and dual-zone preheating enhance reliability, reducing defects. The ETA SS330 selective soldering system is ideal for high-volume production, delivering top performance and flexibility.

DIP Soldering Selective Machine Overview

Precision Flux Delivery

1-1 Precision Fluxing System-Selective Soldering Machine

The Selective Soldering Wave Machine PCB process in the ETA SS330 selective soldering equipment uses a German jet valve for 130μm flux dots with less than 10% solid content. A 1.5L pressure tank and optional jam-detection ensure consistent flux flow. This minimizes waste and enhances soldering quality, making it ideal for high-end electronics production requiring clean, reliable joints.

Uniform Preheating System

1-2 Preheating System-Selective Soldering Machine

The Selective Soldering Wave Machine PCB process benefits from a dual-zone preheating system with adjustable IR heaters. It ensures even heat distribution across PCBs up to 500x500mm, optimizing solder preparation. Durable Panasonic motors and high-temperature insulation reduce downtime, delivering consistent, high-quality soldering for complex assemblies in demanding industries.

Accurate Solder Application

1-3 Soldering Unit-Selective Soldering Machine

The ETA SS330 selective soldering equipment achieves 0.2mm accuracy via an XY platform and stainless steel solder pot. The Swedish electromagnetic pump ensures stable wave control, producing defect-free joints. Industry 4.0-compliant PLC systems enhance efficiency, making the Selective Soldering Wave Machine PCB process reliable for various PCB types and applications.

Specification

Flux System:
- Flux Storage Tank: 1L
- Spray Nozzle: German Jet Valve (130μm, 180/210μm optional)
- Spray Nozzle Size: 130μm (180, 210μm Option)
Preheating System:
- Preheating Mode: IR Heating
- Preheating Area: L500mm*W500mm
- Preheating Zone: Bottom: 1
Soldering System:
- Solder Pot Quantity: 1 set
- Solder Capacity: 11Kg
Software System:
- Operating System: Windows10
- Programming Mode: CCD fast online program, Picture program
Machine Size: L1400W2580H1722mm
Machine Weight: Approx. 700kg

Wave Soldering Machine Selective Case Study Video

Watch our case study video showcasing the I.C.T ETA SS330 selective soldering equipment in action at a Singapore client’s facility. See its precise fluxing, stable PCB handling, and efficient soldering for drives, USBs, and card readers. Learn how this Wave Soldering Machine Selective system boosts quality and efficiency. Contact us for the full video!

More THT Line Machines

I.C.T Selective Wave Soldering Machine DIP Line5

Equipment	Description
Loader	Loads PCB into the production line automatically.
Auto Insertion Machine	Insert DIP component on PCB.
Conveyor	Moves PCB smoothly between machines.
Wave Soldering Machine	Melts solder to bond components securely.
Selective Solder Machine	Melts solder to bond components securely.
AOI Machine	Inspects PCB for defects automatically.
Unloader	Removes finished PCB from the line.

PCB Loading

Insert DIP Component

Insert Odd Component

Wave solder

Selective Wave Solder

DIP AOI

Expert Installation and Training

I.C.T engineers provide hands-on installation and training for the ETA SS330 selective soldering equipment at client facilities. A recent setup included comprehensive guidance, ensuring smooth operation. Group photos with satisfied staff highlight I.C.T’s commitment to reliable equipment and exceptional support, fostering strong partnerships with manufacturers.

Customer Factory and Trusted Partnership 05 Product Factory Details

Expert Installation and Training

Good Feedback 03 Product Factory Details

Certifications for Quality Assurance

Clients praise the I.C.T ETA SS330 selective soldering equipment for its durability, precision, and ease of use. They value its ability to produce high-quality solder joints with minimal defects. I.C.T’s quick pre-sales responses and fast after-sales support minimize downtime, making this mini selective wave soldering machine a top choice for manufacturers.

I.C.T SMT Machine Certificate 01 Product Factory Details

I.C.T Company and Teams

Since 2012, I.C.T has been a leading provider of SMT solutions, delivering innovative equipment like the ETA SS330 selective soldering machine. Based in China, I.C.T serves industries like automotive and military with reliable, high-quality machines. Certified with CE and ISO9001, we offer comprehensive support, from installation to training, ensuring customer satisfaction and high productivity.

I.C.T Factory and Team Product Factory Details

Frequently Asked Questions

How does the I.C.T-SS430 Selective Soldering Equipment ensure soldering accuracy?

The I.C.T-SS430 Selective Soldering Equipment ensures high soldering accuracy through a precision XY motion platform with ±0.2 mm positioning repeatability and advanced PLC motion control. This combination allows stable and repeatable solder joint formation on complex THT selective wave soldering applications. The system precisely controls fluxing, preheating, and soldering paths to avoid overflow and cold joints. It is especially effective for high-density PCBAs, automotive electronics, and mixed-technology boards, where consistent solder quality and process stability are critical in multi-device production environments.
Can the THT Selective Wave Soldering Equipment handle diverse PCB sizes?

Yes, the I.C.T-SS430 supports a wide PCB range from 120 × 60 mm up to 500 × 500 mm, making it suitable for both compact electronic modules and large industrial boards. The adjustable fixture system ensures stable board clamping and accurate positioning during selective soldering processes. This flexibility allows manufacturers to run high-mix THT production lines without frequent fixture changes. It is widely used in EMS factories, automotive electronics, and home appliance PCB assembly where different board sizes must be processed efficiently on a single selective soldering platform.
What maintenance is required for the I.C.T-SS430 Selective Soldering Equipment?

The I.C.T-SS430 requires minimal maintenance due to its dust-proof structure, modular internal layout, and tool-free access design. A built-in residue collection tray simplifies solder waste removal, reducing cleaning time and preventing contamination buildup in the flux and soldering zones. Regular maintenance mainly includes nozzle inspection, flux path cleaning, and periodic calibration of the XY platform. This design significantly reduces downtime in THT selective wave soldering production lines, making it suitable for continuous operation in high-volume electronics manufacturing environments.
Is the I.C.T-SS430 Selective Soldering Equipment suitable for high-volume production?

Yes, the I.C.T-SS430 is designed for high-volume THT selective wave soldering production with optimized fluxing, preheating, and soldering efficiency. Its stable thermal control system ensures consistent solder quality across long production runs, while the automated programming reduces operator intervention. The system supports multi-board batch processing, making it ideal for EMS factories, automotive electronics, and industrial control boards. In multi-device production environments, it maintains high throughput while minimizing defects such as bridging, insufficient solder, or thermal stress damage.
What support is provided for the THT Selective Wave Soldering Equipment?

I.C.T provides full lifecycle support for the SS430 Selective Soldering Equipment, including on-site installation, operator training, process optimization, and preventive maintenance guidance. Engineers assist with program setup, solder path optimization, and integration into existing THT or SMT-DIP hybrid lines. Remote troubleshooting and spare parts supply ensure fast response in case of downtime. This support system helps manufacturers maintain stable production performance, improve yield rates, and fully utilize selective wave soldering capabilities in complex multi-device electronics manufacturing environments.

Additional information

Model	SS550
Flux Storage Tank	2L
Flux Support	Flux Alarm, Automatic
Preheating Mode	Hot air and IR
Preheating Area	L520mm*W500mm
Preheating Zone	Top hot air:1,Bottom IR:1
Warm-up Time	Approx.15min (setting 150℃)
Control Mode	PC+PLC
Nozzle Inner Diameter	Φ 2.5-30mm(Customizable Special dimensions)
Max PCB Size	500*500mm
PCB Thickness	0.2-5.0mm
N2	Purity of N2: 99.998%, 0.3～0.4 MPa,25 L/min,Outer diameter Φ6mm
Power Supply	380±10%, 50/60HZ, 35Kw
Dimension	L2600W1850H1650mm
Weight	Approx:1800kg